System-in-Package allows multiple integrated circuits to be enclosed in a single package. SiP can perform all or most of the electronic functions in a device. These devices include cell phones, and other portable electronic devices which require compact packaging solutions. This technology makes it possible to stack dies containing integrated circuits vertically mounted on top of each other. The previous method was to place the dies next to each other. System-in-Package therefore saves space and allows for ever smaller models to be produced.
Passive components like resistors and capacitors are combined with multiple chips in one package. These chips may include DRAM, flash memory and processor. Everything is mounted on the same substrate. This in turn makes the design less complex and less power is required. SiP delivers highly functional integration for radio frequency and digital applications.
Traditionally portable electronic devices like cell phones contain several different packages. This is why older models were bulky in their design. System-in-Package has taken over as the main technology now because of the demand for ever smaller models. As well as saving space, SiP also speeds up development time and thus reduces costs and allows a quick release of new models.
Previously System-on-Chip (SoC) was used which was a design that used a single chip. However it is difficult to make various modules function correctly on a single chip. This means long development times and then higher costs. Using SiP technology means that different existing elements can simply be stacked vertically.
The shorter time to market has been a big benefit to the companies that produce cell phones and similar mobile devices. This means that they can develop the latest product and have it on the shelves sooner than ever. This speed is thanks to the use of die stacking, which has put an end to horizontal positioning of components. Some people have begun terming it 3D-packaging because of this advancement.